Skip to content
HOME
SERVICES
Toggle "SERVICES" dropdown
SMT ASSEMBLY
MECHANICAL TESTING
SAMPLE PREPARATION
IMAGE ANALYSIS
DROP TOWER
VIBRATION TESTING
THERMAL CYCLING
THERMAL SHOCK & HUMIDITY
RESEARCH PROJECTS
Toggle "RESEARCH PROJECTS" dropdown
Project 1: Thermal Cycling Reliability of Doped SnAgCu Solder Alloys After Long-term Aging
Project 2: Fatigue Properties and Reliability of SnAgCu-Bi Solder Joints in Varying Amplitude Cycling
Project 3: Effects of Creep and Fatigue on the Reliability of SnAgCu Solder Joints in Thermal Cycling
Project 4: Reliability Modeling of Microelectronic Interconnections in Long-term Applications
Project 5: Reliability of Doped SnAgCu Solder Alloys with Various Surface Finishes Under Realistic Service Conditions
Project 6: Statistical and Visual Analysis of Solder Joint Reliability in extreme Environments
Project 7: Mechanical Properties of Micro Alloyed SAC Lead-Free Solder with Bi For Future Electronics
TEAM
GRADUATED ALUMNI
PUBLICATIONS
NEWS
CONTACT
ABOUT
Search
Toggle search interface
Search
Menu
Toggle extended navigation
Search
Toggle search interface
Electronics Manufacturing and Reliability Laboratory (EMRL)
Industrial and Systems Engineering
THERMAL SHOCK & HUMIDITY
close menu