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SMT ASSEMBLY
MECHANICAL TESTING
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THERMAL CYCLING
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RESEARCH PROJECTS
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Project 1: Thermal Cycling Reliability of Doped SnAgCu Solder Alloys After Long-term Aging
Project 2: Fatigue Properties and Reliability of SnAgCu-Bi Solder Joints in Varying Amplitude Cycling
Project 3: Effects of Creep and Fatigue on the Reliability of SnAgCu Solder Joints in Thermal Cycling
Project 4: Reliability Modeling of Microelectronic Interconnections in Long-term Applications
Project 5: Reliability of Doped SnAgCu Solder Alloys with Various Surface Finishes Under Realistic Service Conditions
Project 6: Statistical and Visual Analysis of Solder Joint Reliability in extreme Environments
Project 7: Mechanical Properties of Micro Alloyed SAC Lead-Free Solder with Bi For Future Electronics
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Electronics Manufacturing and Reliability Laboratory (EMRL)
Industrial and Systems Engineering
THERMAL CYCLING
Thermal Cycling Chambers: Operating Temperature: -65°C to 150°C.
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