Research projects
Project 1: Thermal Cycling Reliability of Doped SnAgCu Solder Alloys After Long-term Aging
Eutectic SnPb (Tin-Lead) solder has been used in electronics since early days. This universal alloy combination was used in all soldering applications because it had good mechanical and electrical properties and hence had good reliability.
Project 2: Fatigue Properties and Reliability of SnAgCu-Bi Solder Joints in Varying Amplitude Cycling
The eutectic Sn-Pb solder alloys are widely used in the electronic packaging industry. However, they are being replaced by new near-eutectic solder alloys because of environment and health concerns associated with lead.
Project 3: Effects of Creep and Fatigue on the Reliability of SnAgCu Solder Joints in Thermal Cycling
The reliability of electronic systems is threatened by the failure of one solder interconnection among thousands connecting several components to the PCB. These joints are exposed to different sorts of harsh circumstances such as vibration, drop, and thermal cycling.
Project 4: Reliability Modeling of Microelectronic Interconnections in Long-term Applications
Solder alloy materials are used to form mechanical and electrical connections between printed circuit boards and electronic components. Enhancing the reliability of electronic assemblies is mostly dependent on the reliability of the interconnected solder joints.
Project 5: Reliability of Doped SnAgCu Solder Alloys with Various Surface Finishes Under Realistic Service Conditions
The electronic packaging industry has moved from eutectic Sn-Pb solder materials to near-eutectic SnAgCu (SAC) solder materials in the past decade because of the increasing awareness of health and safety concerns associated with the use of Lead (Pb).
Project 6: Statistical and Visual Analysis of Solder Joint Reliability in extreme Environments
Over the last several decades, surface mount technology has advanced and become the most profitable industry worldwide. Cell phones or some type of hand held technology have become prominent throughout multiple age groups.
Project 7: Mechanical Properties of Micro Alloyed SAC Lead-Free Solder with Bi For Future Electronics
A significant reliability problem with the baseline alloy SAC305 is the deterioration of its mechanical properties and the change in its microstructure after aging.